Assembly guide for microstrip isolators/circulators

　　Storage environment:

　　The product must be stored in a dry and protected environment (such as a nitrogen cabinet or drying cabinet).

　　Conventional operation:

　　In a purified environment, when using products, it is necessary to wear dust-free finger cots, use plastic heads or bamboo tweezers, and avoid damaging the substrate and scratching the microstrip line during operation.

　　Cleaning treatment:

　　The product can be cleaned in anhydrous ethanol, or the surface of the product can be gently wiped with an anhydrous ethanol cotton ball. It is strictly prohibited to clean it in an ultrasonic cleaning machine.

　　Installation operation:

　　Welding process: It is recommended to use solder with a melting point temperature of 183 ℃ or below, such as Sn63Pb37 solder paste or solder pads, for product installation. Use a heating table for welding, and observe the solder fully melted at 200 ℃ before removing the product. The residence time should not exceed 30 seconds.

　　Adhesive process: The conductive adhesive should be small and uniform. After the product is placed in the installation position and pressed tightly, the conductive adhesive can be seen around it; Bake at a curing temperature below 140 ℃.

　　Lead connection:

　　Bonding method: It is recommended to use a bonding alloy wire with a thickness of 25 μ m, a hot ultrasonic bonding temperature of 100-150 ℃, a spherical bonding chopper pressure of 30-55gf, and a wedge-shaped bonding chopper pressure of 15-25gf.

　　Soldering method: Place the box with microstrip products installed on it on a 120 ℃ heating table for preheating. It is recommended to use solder with a melting point temperature of 183 ℃ or below. Then, overlap the pre pressed gold-plated copper foil connecting wire with the flux coated microstrip wire, and use a pointed soldering iron to solder the connecting wire in sequence. The soldering iron is set at a temperature of 210-230 ℃, and the soldering time should not exceed 2 seconds per time. It is required to solder as little as possible and the solder joints should be smooth and round. It is generally not recommended to use soldering for leads.

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